StratEdge Powers Up for 2026: Showcasing Molded Ceramic Packages at IMAPS Device Packaging and GOMACTech

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SANTEE, Calif.--(BUSINESS WIRE)--Feb 27, 2026--

StratEdge Corporation, a leader in the design, production, and assembly of high-frequency, high-power, and high reliability packages, will highlight its molded ceramic and gold plated tab products lines at two March exhibitions. Come see us at the IMAPS Device Packaging Conference exhibition, March 3-4 in Phoenix, AZ, and the GOMACTech exhibition, March 10‑11 in New Orleans, LA.

StratEdge’s gold plated tabs support eutectic die attachment of gallium nitride (GaN) and other high-frequency, high-power devices using gold-tin (AuSn) and gold-silicon (AuSi). For chip-on-board (COB) applications, the chip is attached to the CMC tab before it is installed onto the board. This approach is well-suited for organic boards, which cannot withstand eutectic die attach temperatures.

StratEdge will also be available to discuss molded ceramic package options, including MC Series configurations for RF and microwave applications up to 18 GHz. Molded ceramic packages, with over 200 standard outlines available, provide a vast array of options for applications requiring MIL-STD reliability, such as defense aerospace and harsh environments.

“Our team is ready to help engineers evaluate die-on-tab workflows and packaging options that balance power, reliability, and manufacturability,” said Casey Krawiec, VP of Sales at StratEdge. “As a designer and manufacturer of packages for high-frequency, high-power, and high-reliability devices for over 40 years, we at StratEdge certainly are proponents of the use of packages. But we understand why designers of systems operating in Ku through E bands may decide the advantages of using a tab for COB outweigh the disadvantages.”

Learn more about StratEdge’s packaging and assembly capabilities at www.stratedge.com, and download the new white paper, Die-on-Tab for Compound Semiconductors: Enabling Advanced RF Power Systems, at www.stratedge.com/white-paper-download-tab.html.

Photo:www.stratedge.com/imapsdpc-gomachtech-tabs-molded-ceramic-parts.png

About StratEdge

StratEdge Corporation designs, manufactures, and provides assembly services for a complete line of high-frequency and high-power semiconductor packages operating from DC to 63+ GHz. The StratEdge portfolio includes post-fired ceramic and lower-cost molded ceramic packages and die-on-tab (sub-mount) assembly services engineered for GaN, GaAs, and SiC devices in telecom/5G, VSAT, broadband wireless, satellite, defense, test and measurement, automotive, clean energy, and harsh environments. Our facility in Santee, California, near San Diego, is both ITAR registered and ISO 9001:2015 certified.

View source version on businesswire.com:https://www.businesswire.com/news/home/20260227307562/en/

CONTACT: For more information contact:

Casey Krawiec

StratEdge Corporation

9424 Abraham Way, Santee, CA 92071

Email:[email protected]

Phone: +1.858.569.5000Tricia McGough

TW Marketing (agency)

Email:[email protected]

Phone: +1.254.383.9700

KEYWORD: CALIFORNIA LOUISIANA ARIZONA UNITED STATES NORTH AMERICA

INDUSTRY KEYWORD: OTHER DEFENSE HARDWARE TECHNOLOGY DEFENSE OTHER MANUFACTURING SEMICONDUCTOR 5G SATELLITE PACKAGING ENGINEERING AEROSPACE TELECOMMUNICATIONS MANUFACTURING

SOURCE: StratEdge Corporation

Copyright Business Wire 2026.

PUB: 02/27/2026 05:05 AM/DISC: 02/27/2026 05:05 AM

http://www.businesswire.com/news/home/20260227307562/en