TeraSignal to Demonstrate CMIS-Based Link Training for Linear Optics and Copper Interconnects at OFC 2026

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IRVINE, Calif.--(BUSINESS WIRE)--Mar 10, 2026--

OFC 2026 – TeraSignal, a leader in intelligent interconnect technology, today announced that it will demonstrate CMIS-based link training for linear optics and copper interconnects at OFC 2026, showcasing a major advancement in the deployment of next-generation linear interfaces for optical and copper interconnects. The demonstration incorporates TeraSignal’s TSLink™ link training algorithm directly within the Common Management Interface Specification (CMIS) framework, enabling automatic configuration and optimization of each link to maximize signal-to-noise ratio (SNR) and link margin.

The demonstration highlights how TSLink-enabled CMIS link training enables interoperability between host ASICs and pluggable modules while ensuring optimal signal integrity across real-world channel conditions.

TeraSignal supports the CMIS-LT protocol defined by OIF and actively participates in OIF technical working groups driving the development of interoperable link training standards. The company plans to support all emerging link training protocols, including IEEE’s proposed Inline Link Training / Automatic Path Startup (ILT/APSU), ensuring customers have a standards-aligned solution as the linear interconnect ecosystem continues to evolve.

As the industry transitions to linear interconnect architectures—including Linear Pluggable Optics (LPO), Near-Packaged Optics (NPO), Co-Packaged Optics (CPO), and advanced Active Copper Cables (ACC)—maintaining robust link margin without DSP becomes increasingly challenging. TeraSignal’s TSLink-enabled CMIS solution addresses this challenge by allowing the host ASIC and QSFP/OSFP modules to dynamically tune equalization and operating parameters, ensuring each link is optimized for its specific channel conditions.

“Next-generation linear interconnects require precise, adaptive configuration to achieve the SNR required for reliable operation,” said Dr. Armond Hairapetian, CEO at TeraSignal. “By embedding TSLink link training into CMIS—and aligning closely with OIF standards development while preparing for IEEE ILT/APSU—we enable automatic, standards-based optimization that simplifies deployment and delivers the highest possible performance for both optical and copper links.”

During OFC 2026, TeraSignal will demonstrate real-time CMIS-based link training across linear optical modules and copper interconnects, showing how TSLink automatically configures links for optimal performance, highlighting:

• Live CMIS-based link training between host ASICs and pluggable modules
• Automatic configuration of link parameters using TSLink algorithms
• Optimization for highest possible SNR on a per-link basis
• Compliance with OIF CMIS-LT and readiness for IEEE ILT/APSU
• Linear interfaces between ASICs and QSFP/OSFP modules
• Improved link margin, stability, and reliability without external DSP

OFC attendees are invited to visit TeraSignal at Booth 5436 during OFC 2026 to see the live demonstration. For more information about TeraSignal, TSLink technology, and OFC 2026 activities, visit www.terasignal.com

About TeraSignal

TeraSignal is a leader in high-speed data transmission, specializing in intelligent interconnect solutions for AI Infrastructure, and next generation computing hardware, and Linear Optics. Our technologies and products focus on improving power efficiency, reducing latency, and lowering bit-error-rate, while providing advanced link diagnostics in optical interconnects. Through innovations in CMOS design and adaptive link training, TeraSignal is redefining intelligent optical connectivity across various components in AI infrastructure. Learn more at terasignal.com.

TeraSignal and TSLink are among the trademarks of TeraSignal. Other trademarks are the property of their respective owners.

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SOURCE: TeraSignal

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PUB: 03/10/2026 10:31 AM/DISC: 03/10/2026 10:32 AM

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